We offer the following product structures：

        1.  Double-sided board
        2.  Conventional multi-layer board
        3.  Conventional multi-layer board with blind and buried holes: including 3+3,              2+2+2, 4+4, 2+4 etc. This type of PCB is featured with all blind, buried and              through holes formed by mechanical drilling or blind holes formed by              mechanical and laser drilling.
        4.  Build-up multi-layer board (BUM): Multi-layer PCB for which RCC or copper              and dielectric layer are applied over conventional double-sided or              multi-layer PCB and laser drilling is used. The build-up layer thickness is              equal to or less than 0.15mm (0.006 inch). This type of PCB includes 1+n+1              and 1+1+n+1+1.

   We offer the following surface finishes：

       1.  Hot air solder leveling: A layer of tin or tin lead is applied on bare copper of  PCB after solder mask so as to ensure good soldering of components.  HASL has good solderability.

        2. Immersion gold: A layer of nickel and gold is immersed on bare copper of   PCB by chemical reaction after solder mask so as to ensure good soldering of component or no oxidation of copper surface for future use.  Immersion gold has good surface evenness.

        3. OSP: A layer of metal protective film is applied on bare board of PCB by  chemical reaction so as to ensure no oxidation of copper surface before soldering. OSP has good surface evenness but poor soldering resistance.

       4.  Selective immersion gold:This is combination of immersion gold and OSP.

       5. Immersion tin: A layer of tin is immersed on bare copper of PCB by chemical reaction after solder mask so as to ensure good soldering of components.  Immersion tin has good surface evenness.

       6.  Immersion silver: A layer of silver is immersed on bare copper of PCB by  chemical reaction after solder mask so as to ensure good soldering of components after solder mask. Immersion silver has good surface evenness.