1. 综合词汇 |
Printed circuit |
印制电路 |
Printed wiring |
印制线路 |
Printed circuit board |
印制电路板 |
Printed wiring board |
印制线路板 |
Printed component |
印制元件 |
Printed contact |
印制接点 |
Single-sided printed
circuit board (SSB) |
单面印制电路板 |
double-sided printed
circuit board (SSB) |
双面印制电路板 |
Multilayer printed
circuit board (MLB) |
多层印制电路板 |
Rigid printed circuit board |
刚性印制电路板 |
Flexible printed circuit board |
挠性印制电路板 |
Flex-rigid printed circuit board |
挠性印制电路板 |
Build-up printed board |
积层印制板 |
Surface laminar circuit (SLC) |
表面层合电路板 |
B2it printd board |
埋入凸块互连
印制板 |
ALIVH Multilayer
printd board |
层间全内导通
多层印制板 |
Chip on board (COB) |
载芯片板 |
Backplane |
背板 |
Bare board |
裸板 |
Break-away board |
可断拼板 |
Interconnection |
互连 |
Conductor race line |
导线 |
Substrate |
基底 |
Real estate |
基板面 |
Conductor side |
导线面 |
Component side |
元件面 |
Solder side |
焊接面 |
Printing |
印制 |
grid |
网格 |
pattern |
图形 |
Conductive pattern |
导电图形 |
Non- conductive pattern |
非导电图形 |
Legend |
字符 |
Mark |
标志 |
2． 基材
2.1 基材的种类和结构 |
Base material |
基材 |
Laminate |
层压板 |
Copper-clad laminate (CCL) |
覆铜箔层压板 |
Prepreg |
预浸材料 |
Bonding sheet/bonding layer |
粘结片 |
Epoxy glass substrate |
环氧玻璃基板 |
Copper-clad surface |
铜箔面 |
Foil removal surface |
去铜箔面 |
Length wise direction |
纵向 |
cross wise direction |
横向 |
Core material |
内层芯材 |
|
|
