Item

Mass Production

Trial Run

Layers

32

42

Min  line / space

40/40μm (1.6/1.6mil)

35/35μm (1.4/1.4mil)

Min. laser drill diameter

70μm (2.8mil)

65μm (2.6mil)

Aspect ratio of PTH

16:1

18:1

Min  .core  thickness(excluding copper)

40μm(1.6mil)

30μm(1.2mil)

Anylayer  interconnection

6+2+6

7+2+7

Material

 FR4, Megtron, Rogers, Heavy Copper, etc.

Surface Finish

 Lead-free HASL, ENIG, OSP, Immersion silver, Immersion tin, Flash gold, Gold finger plating, Selective hard gold plating, ENPIG, PdNi plating