Item

Mass Production

Trial Run

Layers

32

42

Board  Thickness

0.1mm~6.0mm

0.1mm~6.5mm

Min  line / space

40/40μm (1.6/1.6mil)

35/35μm (1.4/1.4mil)

Anylayer  interconnection

7+2+7

8+2+8

Min. laser drill diameter

65μm (2.6mil)

50μm (2mil)

Min  .core  thickness(excluding copper)

40μm(1.6mil)

30μm(1.2mil)

Material

 FR4, Megtron, Rogers, Heavy Copper, etc.

Aspect ratio of PTH

20:1

22:1

Min  line / space

copper thickness ≤18um

40/40μm

35/35μm

copper thickness ≤15um

35/35μm

30/30μm

Surface Finish

 Lead-free HASL, ENIG, OSP, Immersion silver, Immersion tin, Flash gold, Gold finger plating, Selective hard gold plating, ENPIG, PdNi plating