Item | ||||||
Mass Production | Trial Run | |||||
Layers | 32 | 42 | ||||
Min line / space | 40/40μm (1.6/1.6mil) | 35/35μm (1.4/1.4mil) | ||||
Min. laser drill diameter | 70μm (2.8mil) | 65μm (2.6mil) | ||||
Aspect ratio of PTH | 16:1 | 18:1 | ||||
Min .core thickness(excluding copper) | 40μm(1.6mil) | 30μm(1.2mil) | ||||
Anylayer interconnection | 6+2+6 | 7+2+7 | ||||
Material | FR4, Megtron, Rogers, Heavy Copper, etc. | |||||
Surface Finish | Lead-free HASL, ENIG, OSP, Immersion silver, Immersion tin, Flash gold, Gold finger plating, Selective hard gold plating, ENPIG, PdNi plating |